technical data sheet 6 lake street, lawrence, ma 01841 gort road business park, ennis, co. clare, ireland. 1-800-446-1158 / (978) 620-2600 / fax: (978) 689-0803 tel: +353 (0) 65 6840044 fax: +353 (0) 65 6822298 website: http://www.microsemi.com voidless - hermetically- sealed ultrafast recovery glass rectifiers qualified per mil-prf-19500/477 t4-lds-0168 rev. 2 (111089) page 1 of 7 devices levels leaded 1n5807 1n5809 1n5811 jan surface mount 1n5807us 1n5809us 1n5811us jantx 1n5807urs 1n5809urs 1N5811URS jantxv jans description b-body leaded package b-body surface mount melf package this ?ultrafast recovery? rectifier diode series is military qualified to mil-prf-19500/477 and is ideal for high-reliability applications where a failure cannot be tolerated. these industry- recognized 6.0 amp rated rectifiers for working peak reverse voltages from 50 to 150 volts are hermetically sealed with voidless-glass construction using an internal ?category i? metallurgical bond. these devices are available in both leaded and surface mount melf package configurations. microsemi also offers numerous other rectifie r products to meet higher and lower current ratings with various recovery time speed requirements including standard, fast and ultrafast device types in both through-hole and surface mount packages. important: for the most current data, consult microsemi?s website: http://www.microsemi.com features ? popular jedec registered 1n5807, 1n5809, 1n5811 ? voidless hermetically sealed glass package ? extremely robust construction ? internal ? category i? metallurgical bonds ? jan, jantx, jantxv, and jans available per mil-prf-19500/477 ? surface mount versions available in a squa re end-cap melf configuration with ?us? suffix
technical data sheet 6 lake street, lawrence, ma 01841 gort road bussiness park, ennis, co. clare, ireland. 1-800-446-1158 / (978) 620-2600 / fax: (978) 689-0803 tel: +353 (0) 65 6840044 fax: +353 (0) 65 6822298 website: http://www.microsemi.com t4-lds-0168 rev. 2 (111089) page 2 of 7 applications / benefits ? ultrafast recovery 6 amp rectifier series 50 to 150v ? military space and other high-relia bility applications ? switching power supplies or other a pplications requiring extremely fast switching & low forward loss ? high forward surge current capability ? low thermal resistance ? controlled avalanche with peak reverse power capability ? inherently radiation hard as d escribed in microsemi micronote 050 maximum ratings ? junction temperature: -65 o c to +175 o c ? storage temperature: -65 o c to +175 o c ? average rectified forward current (i o ): 6 a @ t l = 75oc at 3/8 inch lead length (see note 1) ? thermal resistance: 22 oc/w junction to lead (l=.375 in) ? thermal impedance: 1.5 oc/w @ 10 ms heating time ? forward surge current (8.3 ms half sine) 125 amps ? capacitance: 60 pf at 10 volts, f = 1 mhz ? solder temperature: 260oc for 10 s (maximum) mechanical and packaging ? case: hermetically sealed voidless hard glass with tungsten slugs ? terminations: axial-leads ar e tin/lead (sn/pb) over ni plate over copper. ? marking: body painted and part number, etc. ? polarity: cathode indicated by band ? tape & reel option: standard per eia-296 ? weight: 750 mg ? see package dimensions on last page
technical data sheet 6 lake street, lawrence, ma 01841 gort road bussiness park, ennis, co. clare, ireland. 1-800-446-1158 / (978) 620-2600 / fax: (978) 689-0803 tel: +353 (0) 65 6840044 fax: +353 (0) 65 6822298 website: http://www.microsemi.com t4-lds-0168 rev. 2 (111089) page 3 of 7 electrical characteristics @ t a = 25c type working peak reverse voltage v rwm breakdown voltage (min.) @ 100 ? a v br average rectified current i o1 @t l =75 o c (note 1) average rectified current i o2 @t a =-65 o c note 2 maximum forward voltage @ 4a (8.3 ms pulse) v f reverse current (max) @ v rwm i r surge current (max) i fsm (note 3) reverse recovery time (max) (note 4) t rr volts volts amps volts ? a amps ns 25 o c 125 o c 25 o c 125 o c 1n5807, us, urs 50 60 6.0 3.0 0.875 0.800 5 525 125 30 1n5809, us, urs 100 110 6.0 3.0 0.875 0.800 5 525 125 30 1n5811, us, urs 150 160 6.0 3.0 0.875 0.800 5 525 125 30 note 1: leaded: rated at t l = 75oc at 3/8 inch lead length. derate at 60 ma/oc for t l above 75oc. surface mount: rated at t ec = 75c. derate at 60 ma/oc for t ec above 75oc. note 2: derate linearly at 25 ma/oc above t a = 55oc. this rating is typical for pc boards where thermal resistance from mounting point to ambient is sufficiently controlled where t j(max) does not exceed 175oc note 3: t a = 25 o c @ i o = 3.0 a and v rwm for ten 8.3 ms surges at 1 minute intervals note 4: i f = 1.0 a, i rm = 1.0 a, i r(rec) = 0.10 a and di/dt = 100 a/s min symbols & definitions symbol definition v br minimum breakdown voltage: the minimum voltage the device will exhibit at a specified current. v rwm working peak reverse voltage: the maximum peak voltage that can be applied over the operating temperature range. v f maximum forward voltage: the maximum forward voltage the device will exhibit at a specified current. i r maximum leakage current: the maximum leakage curre nt that will flow at the specified voltage and temperature. c capacitance: the capacitance in pf at a frequency of 1 mhz and specified voltage t rr reverse recovery time: the time interval between the instant the current passes through zero when changing from the forward direction to the reverse dir ection and a specified recovery decay point after a peak reverse current is reached.
technical data sheet 6 lake street, lawrence, ma 01841 gort road bussiness park, ennis, co. clare, ireland. 1-800-446-1158 / (978) 620-2600 / fax: (978) 689-0803 tel: +353 (0) 65 6840044 fax: +353 (0) 65 6822298 website: http://www.microsemi.com t4-lds-0168 rev. 2 (111089) page 4 of 7 graphs figure 1 typical forward current vs. forward voltage figure 2 typical reverse current vs. voltage figure 3 output current vs lead temperature figure 4 forward pulse current vs. duration figure 6 maximum lead temp. vs. pd figure 7 multiple surge current vs. duration
technical data sheet 6 lake street, lawrence, ma 01841 gort road bussiness park, ennis, co. clare, ireland. 1-800-446-1158 / (978) 620-2600 / fax: (978) 689-0803 tel: +353 (0) 65 6840044 fax: +353 (0) 65 6822298 website: http://www.microsemi.com t4-lds-0168 rev. 2 (111089) page 5 of 7 package dimensions dimensions ltr 1n5807, 1n5809, 1n5811 notes inches millimeters min max min max bd .115 .142 2.92 3.61 4 bl .130 .300 3.30 7.62 3 ld .036 .042 0.91 1.07 3 ll .900 1.30 22.86 33.02 note: 1. dimensions are in inches. 2. millimeters are given for ge neral information only. 3. dimension bl shall include the entire body including slugs and sections of the lead over which the diameter is uncontrolled. this uncontrolled area is defined as the z one between the edge of the diode body and extending .050 inch (1.27 mm) onto the leads. 4. dimension bd shall be measured at the largest diameter. 5. in accordance with asme y14.5m, diameters are equivalent to ? x symbology. lead tolerance = + .002 -.003 in *includes sections of the lead or fillet over which the lead diameter is uncontrolled. figure 1. physical dimensions
technical data sheet 6 lake street, lawrence, ma 01841 gort road bussiness park, ennis, co. clare, ireland. 1-800-446-1158 / (978) 620-2600 / fax: (978) 689-0803 tel: +353 (0) 65 6840044 fax: +353 (0) 65 6822298 website: http://www.microsemi.com t4-lds-0168 rev. 2 (111089) page 6 of 7 package dimensions pad layout note 1: 1. dimensions are in inches. 2. millimeters are given for ge neral information only. 3. dimensions are pre-solder dip. 4. minimum clearance of glass body to mounting surface on all orientations. 5. cathode marking to be either in color band, three dots sp aced equally, or a color dot on the face of the end tab. 6. color dots will be .020 inch (0.51 mm) diameter minimum and those on the face of the end tab shall not lie within .020 inch (0.51 mm) of the mounting surface. 7. in accordance with asme y14.5m, diameters are equivalent to ? x symbology. note 2: this package outline has also prev iously been identified as ?d-5b? figure 2a. physical dimensions of us surface mount family inches mm a 0.288 7.32 b 0.070 1.78 c 0.155 3.94 note: if mounting requires adhesive separate from the solder, an additional 0.080 inch diameter contact may be placed in the center between the pads as an optional spot for cement. dimensions ltr 1n5807us, 1n5809us, 1n5811us notes inches millimeters min max min max bd .137 .148 3.84 3.76 bl .200 .225 5.08 5.72 ect .019 .028 0.48 0.71 s .003 0.08
technical data sheet 6 lake street, lawrence, ma 01841 gort road bussiness park, ennis, co. clare, ireland. 1-800-446-1158 / (978) 620-2600 / fax: (978) 689-0803 tel: +353 (0) 65 6840044 fax: +353 (0) 65 6822298 website: http://www.microsemi.com t4-lds-0168 rev. 2 (111089) page 7 of 7 package dimensions notes: 1. dimensions are in inches. 2. millimeters are given for general information only. 3. dimensions are pre-solder dip. 4. minimum clearance of glass body to mounting surface on all orientations. 5. 5. cathode marking to be either in color band, three dots spaced equally, or a color dot on the face of the end tab. 6. color dots will be .020 inch (0.51 mm) diameter minimum and those on the face of the end tab shall not lie within .020 inch (0.51 mm) of the mounting surface. 7. in accordance with asme y14.5m, diameters are equivalent to ? x symbology. 8. one endcap shall be square and th e other endcap shall be round. figure 2b. physical dimensions of urs surface mount family . dimensions ltr 1n5802urs, 1n5804urs, 1n5806urs notes inches millimeters min max min max 8 bd .091 .103 2.31 2.62 bl .168 .200 4.27 5.08 ect .019 .028 0.48 0.71 8 s .003 0.08
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